레이저 PCB 탈판화 기계 선택적 스테인리스 스틸 인라인

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January 19, 2024
Category Connection: 레이저 PCB 디파 닐링 기계
중국산 고품질 레이저 PCB 디패널링 머신
https://www.depanelingmachine.com/china-laser_pcb_depaneling_machine_optional_stainless_steel_inline-42645789.html
첸젠 SMTfly 전자 장비 제조업소 중국산 품질 제조업체
우리는 공급할 수 있습니다:
PCB 라우터 기계: https://www.depanelingmachine.com/supplier-pcb_router_machine-433122.html
PCB 디패널링 머신: https://www.depanelingmachine.com/supplier-pcb_depaneling_machine-433269.html
레이저 PCB 디패널링 머신: https://www.depanelingmachine.com/supplier-laser_pcb_depaneling_machine-433054.html
우리의 공식 웹 사이트를 방문하는 것을 환영합니다: http://www.depanelingmachine.com
Brief: Discover the 17W Laser PCB Depaneling Machine with optional stainless steel inline configuration. This advanced machine offers precise, stress-free PCB depaneling with no tooling costs, exceptional cut quality, and versatility for various substrates. Perfect for complex PCB designs and high tolerance requirements.
Related Product Features:
  • No tooling cost or consumables, reducing operational expenses.
  • No mechanical stress on substrates or circuits, ensuring integrity.
  • Fiducial Recognition for precise and clean-cut depaneling.
  • Holds tolerances as small as <50 microns for extraordinary cut quality.
  • Versatile with ability to change applications by adjusting settings.
  • Optical Recognition ensures accuracy before depaneling begins.
  • Can depanel virtually any substrate including Rogers, FR4, and ceramics.
  • No design limitations, capable of cutting complex contours and multidimensional boards.
Faqs:
  • What substrates can the Laser PCB Depaneling Machine handle?
    The machine can depanel virtually any substrate, including Rogers, FR4, Chema, Teflon, ceramics, aluminum, brass, and copper.
  • What is the cutting accuracy of the Laser PCB Depaneling Machine?
    The cutting accuracy of the whole machine is 0.02mm, ensuring high precision for your PCB depaneling needs.
  • Does the machine support automatic compensation for shrinkage and expansion?
    Yes, the machine features automatic compensation of MARK points to handle shrinkage and expansion during the depaneling process.