Laser Depaneling PCB Separator for 600*450mm PCB Boards
1. Principle of PCB laser cutting machine
2. Technical Parameters
| Parameter | ||
|
Technical parameters |
Main body of laser | 1480mm*1360mm*1412 mm |
| Weight of the | 1500Kg | |
| Power | AC220 V | |
| Laser | 355 nm | |
| Laser |
Optowave 10W(US) |
|
| Material | ≤1.2 mm | |
| Precisio | ±20 μm | |
| Platfor | ±2 μm | |
| Platform | ±2 μm | |
| Working area | 600*450 mm | |
| Maximum | 3 KW | |
| Vibrating | CTI(US) | |
| Power | AC220 V | |
| Diameter | 20±5 μm | |
| Ambient | 20±2 ℃ | |
| Ambient | ＜60 % | |
| The Machine | Marble | |
3. Advantages
High precision CCD automatic positioning, automatic focusing. Fast and accurate positioning, save time and no worries.
Friendly interface,Simple operation, easy to use, free application; Small size, Save more space; rigorous security design;
Reduce energy consumption, Cost savings.
Cost-effective, fast cutting speed, stable performance
